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H Selective Soldering System

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H Selective Soldering System


ModelHPS5/55
Equipment parameterDimension(L*W*H)4200*1915*1571mm
Transport parameterTransport width adjustment50-510mm
PCB size510*510mm
Conveyor height900±20(mm)
Soldering systemSolder potElectromagnetic pump solder pot
N2 consumption1.5-2m³/h/potx1
Solder pot numbersSingle track single pot/double pots
Module numbersOne/Two/Three modules



Single pot Daul pots Daul pots individual Control

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