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| Brand Name : | YUSH |
| Model Number : | YS-X5600 |
| Price : | USD31940 |
| Payment Terms : | L/C,D/A,D/P,T/T,Western Union |
| Supply Ability : | 1000 |
| Delivery Time : | 20work days |
1.Application:
| 1: Semiconductor | 2: Automotiveelectronics | 3: PCB’A | 4: LED |
| 5: BGA/QFN inspection | 6: Aluminum die casting | 7: Mould | 8: Electrical and mechanical components |
| 9: Biological agriculture seed | 10: Aviation component | 11: Wheel hub | 12: Wire/USB/Plug |
2.Functions and Features:
| Function | Advantages |
| X-ray detector can move along Z direction, Speed of table moving along X-Y direction can be adjusted. | Larger effective detection range, improving the magnification and the detection efficiency of the product. |
| Long life X-ray tube, maintenance free for life | Adopt the world's top Japanese Hamamatsu X-ray source |
| Fault less than 2.5μm can be detected. High detection repeat accuracy. | Easy to distinguish the gold wire bending and break of the semiconductor package. |
| Powerful CNC Measuring Function, can inspect automatically, testing program can be edited. | Suitable for large-scale inspection and improve detection efficiency. |
| Small body, easy to place, less space | Can be used in laboratories, materials rooms, etc. |
| Large navigation view, table will move to where you click the mouse. | Very easy to operate, quickly find item defects and improve detection efficiency |
3.Application Advantage:
4.Automatic Void Ratio Calculation
Enhanced BGA inspection function
YS-X5600 can quickly select and mark a single solder ball, or select the solder balls to be inspected by matrix box ; it can manually or automatically identify BGA solder balls and complete the inspection. Follow the system guidelines to easily complete the inspection process and ensure accurate and reliable inspection results.
5.X-Ray Working Principle

6.CNC Programming
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